The core pain point solved: the product was scratched and stamped during transportation Value brought: It can provide perfect "soft contact" buffer. It adheres closely to the product surface without any indentations, scratches or abrasion.

The core pain point to be solved: packaging fails in wet, outdoor or oily environments. Value brought: Water resistant, oil, acid, alkali, salt, non-corrosion. Outstanding ultraviolet (UV) resistance, and will not be powdering or cracked when used outdoors.

Core pain points to be solved: increasingly stringent global environmental regulations (such as REACH, RoHS) Value brought: Clean and safe: no odor, low volatility, meeting high standards such as food contact and automobile interiors.

The core pain point to be solved: special-shaped products do not have suitable packaging, or require special functions such as anti-static electricity Value brought: Deep processing such as cutting, laminating, heat sealing, molding, and gluing can be easily carried out, and antistatic agents or conductive carbon black can be added for packaging electronic components.